Morning Overview on MSN

MIT finds a new way to pack more transistors on a chip

For decades, chipmakers have squeezed more computing power out of silicon by shrinking transistors, but that strategy is ...

Microscale CMOS chip reshapes optical control for scalable quantum computers

CMOS-built optical phase modulators shrink laser control hardware and power use for trapped atom quantum computers, enabling ...
Electronics For You

Ultra-Thin Materials Bring 3D Chips Closer

MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy.
DATAQUEST

R&D advances for FAMES pilot line: 400 °C CMOS breakthrough opens critical doors to 3D integration goals

Devices match electrical performance of devices fabricated at standard thermal budget (>1000 °C), removing a barrier to large ...
New Electronics

CEA-Leti achieves low-temperature CMOS breakthrough for 3D chip integration

CEA-Leti has announced a major advance in semiconductor manufacturing, successfully fabricating fully functional 2.5 V SOI ...

MIT electronics researchers develop a new way to fabricate transistors on the backend of finished dies, to keep pushing the limit of chip densities ever higher

Traditional CMOS chips are fabricated by applying and then etching repeated layers of different materials, applied to a wafer ...
Design And Reuse

First-ever quantum chip combining electronics and photonics made in commercial CMOS foundry

A team from Boston University, UC Berkeley, and Northwestern University has created the first chip that integrates quantum light sources with electronic control circuits in a standard 45 nm CMOS ...